Hot embossing of thermoplastic multilayered stacks
A. Kolew, M. Heilig, M. Schneider, K. Sikora, D. Münch, M. WorgullVolume:
18
Language:
english
DOI:
10.1007/s00542-012-1502-4
Date:
November, 2012
File:
PDF, 337 KB
english, 2012