The influence of adhesive materials on chip-on-board...

The influence of adhesive materials on chip-on-board packing of MEMS microphone

Cheng-Hsin Chuang, Yi-Hsuan Huang, Shin-Li Lee
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Volume:
18
Language:
english
DOI:
10.1007/s00542-012-1575-0
Date:
November, 2012
File:
PDF, 747 KB
english, 2012
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