![](/img/cover-not-exists.png)
The influence of adhesive materials on chip-on-board packing of MEMS microphone
Cheng-Hsin Chuang, Yi-Hsuan Huang, Shin-Li LeeVolume:
18
Language:
english
DOI:
10.1007/s00542-012-1575-0
Date:
November, 2012
File:
PDF, 747 KB
english, 2012