![](/img/cover-not-exists.png)
The effect of adding Ni and Ge microelements on the electromigration resistance of low-Ag based SnAgCu solder
X. Zhao, M. Saka, M. Yamashita, H. HokazonoVolume:
18
Language:
english
DOI:
10.1007/s00542-012-1577-y
Date:
December, 2012
File:
PDF, 1.05 MB
english, 2012