The effect of adding Ni and Ge microelements on the...

The effect of adding Ni and Ge microelements on the electromigration resistance of low-Ag based SnAgCu solder

X. Zhao, M. Saka, M. Yamashita, H. Hokazono
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Volume:
18
Language:
english
DOI:
10.1007/s00542-012-1577-y
Date:
December, 2012
File:
PDF, 1.05 MB
english, 2012
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