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Formation of AuSnxIMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow processes
Wei Liu, Yanhong Tian, Chunqing Wang, Lining SunVolume:
24
Language:
english
DOI:
10.1007/s10854-012-0715-8
Date:
January, 2013
File:
PDF, 948 KB
english, 2013