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Characterization of interfacial IMCs in low-Ag Sn–Ag–xCu–Bi–Ni solder joints
Yang Liu, Fenglian Sun, Yang LiuVolume:
24
Language:
english
DOI:
10.1007/s10854-012-0741-6
Date:
January, 2013
File:
PDF, 587 KB
english, 2013