Effect of isothermal annealing and electromigration...

Journal of Materials Science: Materials in Electronics 2013 / 02 Vol. 24; Iss. 2

Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading

T. Laurila, J. Karppinen, J. Li, V. Vuorinen, M. Paulasto-Kröckel
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Volume:
24
Language:
english
DOI:
10.1007/s10854-012-0783-9
Date:
February, 2013
File:
PDF, 1001 KB
english, 2013
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