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HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process
Cheng-Li Chuang, Min-Yi KangVolume:
41
Language:
english
DOI:
10.1007/s11664-012-2033-6
Date:
September, 2012
File:
PDF, 1.23 MB
english, 2012