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Enhancement of the Bondability and Die-Shear Force of Chip–Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate
Cheng-Li Chuang, Jong-Ning Aoh, Chi-Chuan PanVolume:
41
Language:
english
DOI:
10.1007/s11664-012-2172-9
Date:
September, 2012
File:
PDF, 954 KB
english, 2012