Linkages Between Microstructure and Mechanical Properties...

Journal of Electronic Materials 2013 / 02 Vol. 42; Iss. 2

Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects

Zhiyong Wu, Zhiheng Huang, Hua Xiong, Paul P. Conway, Changqing Liu
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Volume:
42
Language:
english
DOI:
10.1007/s11664-012-2201-8
Date:
February, 2013
File:
PDF, 838 KB
english, 2013
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