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Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading
T. Laurila, J. Karppinen, V. Vuorinen, J. Li, A. Paul, M. Paulasto-KröckelVolume:
41
Language:
english
DOI:
10.1007/s11664-012-2223-2
Date:
November, 2012
File:
PDF, 1.61 MB
english, 2012