Effects of High-Temperature Treatment on the Reaction Between Sn-3%Ag-0.5%Cu Solder and Sputtered Ni-V Film on Ferrite Substrate
Xiaohu Shen, Hao Jin, Shurong Dong, Hei Wong, Jian Zhou, Zhaodi Guo, Demiao WangVolume:
41
Language:
english
DOI:
10.1007/s11664-012-2238-8
Date:
November, 2012
File:
PDF, 783 KB
english, 2012