Thermal Parameters, Microstructure, and Mechanical...

Journal of Electronic Materials 2013 / 01 Vol. 42; Iss. 1

Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli
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Volume:
42
Language:
english
DOI:
10.1007/s11664-012-2263-7
Date:
January, 2013
File:
PDF, 1.61 MB
english, 2013
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