Study of Electromigration-Induced Failures on Cu Pillar...

Journal of Electronic Materials 2012 / 12 Vol. 41; Iss. 12

Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates

Yu-Hsiang Hsiao, Kwang-Lung Lin, Chiu-Wen Lee, Yu-Hsiu Shao, Yi-Shao Lai
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Volume:
41
Language:
english
DOI:
10.1007/s11664-012-2293-1
Date:
December, 2012
File:
PDF, 1.64 MB
english, 2012
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