Experimental Evaluation of the Effect of Pad Debris Size on...

Journal of Electronic Materials 2013 / 01 Vol. 42; Iss. 1

Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process

Ji Chul Yang, Hojoong Kim, Dong Won Oh, Jai-Hyung Won, Chil-Gee Lee, Taesung Kim
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Volume:
42
Language:
english
DOI:
10.1007/s11664-012-2334-9
Date:
January, 2013
File:
PDF, 557 KB
english, 2013
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