The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical...

Journal of Electronic Materials 2013 / 02 Vol. 42; Iss. 2

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

Tae-Kyu Lee, Bite Zhou, Thomas R. Bieler, Chien-Fu Tseng, Jeng-Gong Duh
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Volume:
42
Language:
english
DOI:
10.1007/s11664-012-2340-y
Date:
February, 2013
File:
PDF, 1.71 MB
english, 2013
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