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Electroless deposition of NiMoP films using alkali-free chemicals for capping layers of copper interconnections
Hae-Min Lee, Heeyeop Chae, Chang-Koo KimVolume:
29
Language:
english
DOI:
10.1007/s11814-011-0301-4
Date:
September, 2012
File:
PDF, 1.23 MB
english, 2012