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Polymer-based zero-level packaging technology for high frequency RF applications by wafer bonding/debonding technique using an anti-adhesion layer
Jang-Gil Kim, Seonho Seok, Nathalie Rolland, Paul-Alain RollandVolume:
13
Language:
english
DOI:
10.1007/s12541-012-0244-7
Date:
October, 2012
File:
PDF, 654 KB
english, 2012