Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder
Ming-jie Dong, Zhi-ming Gao, Yong-chang Liu, Xun Wang, Li-ming YuVolume:
19
Language:
english
DOI:
10.1007/s12613-012-0665-4
Date:
November, 2012
File:
PDF, 487 KB
english, 2012