High temperature intergranular crack growth processes in copper and copper with 1 wt% antimony
J.C Earthman, J.C Gibeling, W.D NixVolume:
33
Year:
1985
Language:
english
Pages:
13
DOI:
10.1016/0001-6160(85)90104-x
File:
PDF, 2.56 MB
english, 1985