Non-destructive analysis of materials and devices by means...

Non-destructive analysis of materials and devices by means of scanning acoustic microscopy

J. van den Berg, J. van Oijen, H.W. Werner
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Volume:
297
Year:
1994
Language:
english
Pages:
14
DOI:
10.1016/0003-2670(93)e0709-g
File:
PDF, 3.11 MB
english, 1994
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