Spreading process and interfacial characteristic of Sn–17Bi–0.5Cu/Ni at temperatures ranging from 523 K to 673 K
Likun Zang, Zhangfu Yuan, Yuanqing Zhu, Bingsheng Xu, Hiroyuki Matsuura, Fumitaka TsukihashiVolume:
414
Year:
2012
Language:
english
DOI:
10.1016/j.colsurfa.2012.08.052
File:
PDF, 2.34 MB
english, 2012