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Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating
Nguyen T.M. Hai, Karl W. Krämer, Alexander Fluegel, Marco Arnold, Dieter Mayer, Peter BroekmannVolume:
83
Year:
2012
Language:
english
DOI:
10.1016/j.electacta.2012.07.036
File:
PDF, 1.19 MB
english, 2012