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Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder
Cheng-Ying Ho, Jenq-Gong DuhVolume:
92
Year:
2013
Language:
english
DOI:
10.1016/j.matlet.2012.10.063
File:
PDF, 409 KB
english, 2013