Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy...

Microelectronics Reliability 2012 Vol. 52; Iss. 11

Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products

Dhafer Abdul-Ameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che
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Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.03.028
File:
PDF, 1.76 MB
english, 2012
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