Effects of TSVs (through-silicon vias) on thermal...

Microelectronics Reliability 2012 Vol. 52; Iss. 11

Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)

John H. Lau, Tang Gong Yue
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Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.04.002
File:
PDF, 2.27 MB
english, 2012
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