Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs)
Qianwen Chen, Cui Huang, Zheyao WangVolume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.06.001
File:
PDF, 1.20 MB
english, 2012