Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart VandeveldeVolume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.06.024
File:
PDF, 1.21 MB
english, 2012