A new approach for making electrically conductive...

Microelectronics Reliability 2012 Vol. 52; Iss. 9-10

A new approach for making electrically conductive interconnections between small contacts in failure analysis

Andreas Rummel, Klaus Schock, Andrew Smith, Stephan Kleindiek
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.06.050
File:
PDF, 1.28 MB
english, 2012
Conversion to is in progress
Conversion to is failed