Evaluation by three-point-bend and ball-on-ring tests of...

Microelectronics Reliability 2012 Vol. 52; Iss. 9-10

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen
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Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.06.093
File:
PDF, 823 KB
english, 2012
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