Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules
O. Schilling, M. Schäfer, K. Mainka, M. Thoben, F. SauerlandVolume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.06.095
File:
PDF, 1.72 MB
english, 2012