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Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers
L. Meinshausen, H. Frémont, K. Weide-ZaageVolume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.06.127
File:
PDF, 554 KB
english, 2012