Mechanical and electronic properties of Ag3Sn intermetallic...

Materials Science and Engineering: B 2013 Vol. 178; Iss. 1

Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation

Santosh Kumar, JaePil Jung
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Volume:
178
Year:
2013
Language:
english
DOI:
10.1016/j.mseb.2012.10.003
File:
PDF, 1.41 MB
english, 2013
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