Effects of SU-8 Cross-linking on Flip-Chip Bond Strength...

Procedia Engineering 2011 Vol. 25; Iss. none

Effects of SU-8 Cross-linking on Flip-Chip Bond Strength when Assembling and Packaging MEMS

Nathan E. Glavitz, LaVern A. Starman, Ronald A. Coutu Jr., Richard L. Johnston
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Volume:
25
Year:
2011
Language:
english
DOI:
10.1016/j.proeng.2011.12.117
File:
PDF, 558 KB
english, 2011
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