Evaluation of Thin Film Indium Bonding at Wafer Level

Procedia Engineering 2011 Vol. 25; Iss. none

Evaluation of Thin Film Indium Bonding at Wafer Level

Rahel Straessle, Yves Pétremand, Danick Briand, Nico F. de Rooij
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Volume:
25
Year:
2011
Language:
english
DOI:
10.1016/j.proeng.2011.12.369
File:
PDF, 377 KB
english, 2011
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