Eliminate Kirkendall voids in solder reactions on...

Scripta Materialia 2013 / 3 Vol. 68; Iss. 5

Eliminate Kirkendall voids in solder reactions on nanotwinned copper

Liu, Tao-Chi, Liu, Chien-Min, Huang, Yi-Sa, Chen, Chih, Tu, King-Ning
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Volume:
68
Language:
english
Journal:
Scripta Materialia
DOI:
10.1016/j.scriptamat.2012.10.024
Date:
March, 2013
File:
PDF, 564 KB
english, 2013
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