Electrical interconnection in anodic bonding of silicon wafer to LTCC wafer using highly compliant porous bumps made from submicron gold particles
Shuji Tanaka, Mamoru Mohri, Toshinori Ogashiwa, Hideyuki Fukushi, Katsunao Tanaka, Daisuke Nakamura, Takashi Nishimori, Masayoshi EsashiVolume:
188
Year:
2012
Language:
english
DOI:
10.1016/j.sna.2012.01.003
File:
PDF, 766 KB
english, 2012