Sharp silicon tips with different aspect ratios in wet...

Sharp silicon tips with different aspect ratios in wet etching/DRIE and surfactant-modified TMAH etching

Bin Tang, Kazuo Sato, Miguel A. Gosálvez
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Volume:
188
Year:
2012
Language:
english
DOI:
10.1016/j.sna.2012.01.031
File:
PDF, 1.85 MB
english, 2012
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