Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection
M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, M. EsashiVolume:
188
Year:
2012
Language:
english
DOI:
10.1016/j.sna.2012.04.032
File:
PDF, 1.96 MB
english, 2012