Integration and packaging technology of MEMS-on-CMOS...

Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, M. Esashi
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
188
Year:
2012
Language:
english
DOI:
10.1016/j.sna.2012.04.032
File:
PDF, 1.96 MB
english, 2012
Conversion to is in progress
Conversion to is failed