![](/img/cover-not-exists.png)
Interfacial characteristics and microstructural evolution of Sn–6.5Zn solder/Cu substrate joints during aging
Guo-ji ZHAO, Guang-min SHENG, Li-li WU, Xin-jian YUANVolume:
22
Year:
2012
Language:
english
DOI:
10.1016/s1003-6326(11)61413-1
File:
PDF, 2.40 MB
english, 2012