![](/img/cover-not-exists.png)
Module packing based on the BSG-structure and IC layout applications
Nakatake, S., Fujiyoshi, K., Murata, H., Kajitani, Y.Volume:
17
Year:
1998
Language:
english
DOI:
10.1109/43.703832
File:
PDF, 494 KB
english, 1998