Interconnect thermal modeling for accurate simulation of...

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2000 Vol. 19; Iss. 2

Interconnect thermal modeling for accurate simulation of circuit timing and reliability

Danqing Chen, Erhong Li, Rosenbaum, E., Sung-Mo Kang
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Volume:
19
Year:
2000
Language:
english
DOI:
10.1109/43.828548
File:
PDF, 258 KB
english, 2000
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