Flip-chip bonded 0.85-μm bottom-emitting vertical-cavity...

Flip-chip bonded 0.85-μm bottom-emitting vertical-cavity laser array on an AlGaAs substrate

Ohiso, Y., Tateno, K., Kohama, Y., Wakatsuki, A., Tsunetsugu, H., Kurokawa, T.

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Volume:

Year:

1996

Language:

english

DOI:

10.1109/68.531807

File:

PDF, 290 KB

english, 1996

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