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A novel technique for high-strength direct fiber-to-Si submount attachment using field-assisted anodic bonding for optoelectronics packaging
D.C. Abeysinghe, V. Ranatunga, A. Balagopal, Haichuan Mu, Kuntao Ye, D. KlotzkinVolume:
16
Year:
2004
Language:
english
DOI:
10.1109/lpt.2004.833095
File:
PDF, 257 KB
english, 2004