A novel technique for high-strength direct fiber-to-Si...

IEEE Photonics Technology Letters 2004 Vol. 16; Iss. 9

A novel technique for high-strength direct fiber-to-Si submount attachment using field-assisted anodic bonding for optoelectronics packaging

D.C. Abeysinghe, V. Ranatunga, A. Balagopal, Haichuan Mu, Kuntao Ye, D. Klotzkin
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Volume:
16
Year:
2004
Language:
english
DOI:
10.1109/lpt.2004.833095
File:
PDF, 257 KB
english, 2004
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