Stress Buildup of Sn3.5Ag Soldered Stacked CSPs to...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 3

Stress Buildup of Sn3.5Ag Soldered Stacked CSPs to Board-Level Drop Impact

Cheng-Fu Chen, Peterson, D.C.
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2010.2100290
File:
PDF, 1.14 MB
english, 2011
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