Methodology to Predict Substrate Warpage and Different...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 7

Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets

Raghavan, S., Klein, K., Yoon, S., Joong-Do Kim, Kyoung-Sik Moon, Wong, C.P., Sitaraman, S.K.
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2010.2101074
File:
PDF, 1.47 MB
english, 2011
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