Adhesion and Evaluation of Thermoplastic Nonconductive Film...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 7

Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex

Chin-Tang Hsieh, Kun-Hou Liao, Guo-Ju Chen, Chen-Mu Lee, Hung-Jan Lin, Kai-Jen Cheng
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2114884
File:
PDF, 934 KB
english, 2011
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