Electrical Design and Techniques for an Embedded...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 10

Electrical Design and Techniques for an Embedded High-Pin-Count LSI Chip Package

Ohshima, D., Sasaki, H., Mori, K., Fujimura, Y., Kikuchi, K., Nakashima, Y., Funaya, T., Nishiyama, T., Murakami, T., Enomoto, M., Miki, R., Yamamichi, S.
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2128868
File:
PDF, 2.11 MB
english, 2011
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