Phenomenological Study of the Effect of Microstructural...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 10

Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

Coyle, R., Osenbach, J., Collins, M.N., McCormick, H., Read, P., Fleming, D., Popowich, R., Punch, J., Reid, M., Kummerl, S.
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2140109
File:
PDF, 1.47 MB
english, 2011
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