Changes in Adhesion of Non-Conductive Adhesive Attachments...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 7

Changes in Adhesion of Non-Conductive Adhesive Attachments During Humidity Test

Saarinen, K., Frisk, L.
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2141992
File:
PDF, 421 KB
english, 2011
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