Brittle Versus Ductile Failure of a Lead-Free Single Solder Joint Specimen Under Intermediate Strain Rate
Jianping Jing, Feng Gao, Johnson, J., Liang, F.Z., Williams, R.L., Jianmin QuVolume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2146259
File:
PDF, 1.75 MB
english, 2011